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US Patent 7780867 Edge bevel removal of copper from silicon wafers

Patent 7780867 was granted and assigned to Novellus Systems on August, 2010 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
Novellus Systems
Novellus Systems
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Date Filed
October 11, 2005
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Date of Patent
August 24, 2010
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Patent Application Number
11248874
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Patent Citations Received
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US Patent 11908680 Substrate processing method and substrate processing apparatus
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US Patent 11710629 Substrate processing apparatus and substrate processing method
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Patent Inventor Names
Douglas A. Preston
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Seshasayee Varadarajan
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Steven T. Mayer
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7780867
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Patent Primary Examiner
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Duy-Vu N Deo
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