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US Patent 11710629 Substrate processing apparatus and substrate processing method

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Patent
Patent
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Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
117106290
Date of Patent
July 25, 2023
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Patent Application Number
173497020
Date Filed
June 16, 2021
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Patent Citations
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US Patent 7722736 Apparatus for and method of processing a substrate with processing liquid
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US Patent 7780867 Edge bevel removal of copper from silicon wafers
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US Patent 7811412 Substrate processing apparatus and substrate processing method drying substrate
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US Patent 7927429 Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium
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US Patent 7935217 Substrate processing apparatus for treating substrate with predetermined processing by supplying processing liquid to rim portion of rotating substrate
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US Patent 8113221 Substrate cleaning method, substrate cleaning apparatus and computer readable recording medium
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US Patent 8127391 Subtrate treatment apparatus
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US Patent 8337659 Substrate processing method and substrate processing apparatus
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...
Patent Primary Examiner
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Natasha N Campbell
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A substrate processing apparatus includes a substrate holder, and a discharge head for peripheral area from which a fluid is discharge toward a surface peripheral area of the substrate held on the substrate holder. The discharge head for peripheral area includes multiple nozzles, and a support part that supports the nozzles integrally. The nozzles include a processing liquid nozzle from which a processing liquid is discharged toward the surface peripheral area, and a gas nozzle from which gas is discharged toward the surface peripheral area. The gas nozzle is placed upstream of a rotative direction of the substrate relative to the processing liquid nozzle.

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