US Patent 7553745 Integrated circuit package, panel and methods of manufacturing the same

A method of manufacturing an integrated circuit package includes: assembling a composite wafer including alternating rows or columns of first and second strips on an adhesive tape, the first strips including a plurality of first dies and the second strips including a plurality of second dies, singulating the first dies from the first strips and the second dies from the second strips, forming a bond wire between respective ones of the first dies and respective ones of the second dies, thereby forming a plurality of component, embedding the components in mold compound, thereby forming a panel and separating the components from the panel, thereby forming individual integrated circuit packages.