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US Patent 7354798 Three-dimensional device fabrication method
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Edits on 6 Nov, 2024
"update inverses"
Golden AI
edited on 6 Nov, 2024
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Patent Citations Received
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
Edits on 30 Oct, 2024
"update inverses"
Golden AI
edited on 30 Oct, 2024
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Patent Citations Received
US Patent 12132020 Low temperature bonded structures
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Edits on 24 Oct, 2024
"update inverses"
Golden AI
edited on 24 Oct, 2024
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Patent Citations Received
US Patent 12125784 Interconnect structures
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Edits on 9 Oct, 2024
"update inverses"
Golden AI
edited on 9 Oct, 2024
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Patent Citations Received
US Patent 12113056 Stacked dies and methods for forming bonded structures
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Edits on 4 Sep, 2024
"update inverses"
Golden AI
edited on 4 Sep, 2024
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Patent Citations Received
US Patent 12080672 Direct gang bonding methods including directly bonding first element to second element to form bonded structure without adhesive
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Edits on 22 Aug, 2024
"update inverses"
Golden AI
edited on 22 Aug, 2024
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Patent Citations Received
US Patent 12068278 Processed stacked dies
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Edits on 7 Aug, 2024
"update inverses"
Golden AI
edited on 7 Aug, 2024
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Patent Citations Received
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Edits on 24 Jul, 2024
"update inverses"
Golden AI
edited on 24 Jul, 2024
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Patent Citations Received
0
"update inverses"
Golden AI
edited on 24 Jul, 2024
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Patent Citations Received
0
"update inverses"
Golden AI
edited on 24 Jul, 2024
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Patent Citations Received
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Edits on 3 Jul, 2024
"update inverses"
Golden AI
edited on 3 Jul, 2024
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Patent Citations Received
US Patent 12027487 Structures for low temperature bonding using nanoparticles
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Edits on 29 May, 2024
"update inverses"
Golden AI
edited on 29 May, 2024
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Patent Citations Received
US Patent 11996383 Bonded semiconductor devices and methods of forming the same
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Edits on 1 May, 2024
"update inverses"
Golden AI
edited on 1 May, 2024
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Patent Citations Received
US Patent 11973056 Methods for low temperature bonding using nanoparticles
0
Edits on 10 Apr, 2024
"update inverses"
Golden AI
edited on 10 Apr, 2024
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Patent Citations Received
US Patent 11955463 Direct bonded stack structures for increased reliability and improved yield in microelectronics
0
"update inverses"
Golden AI
edited on 10 Apr, 2024
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Patent Citations Received
US Patent 11955445 Metal pads over TSV
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"update inverses"
Golden AI
edited on 10 Apr, 2024
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Patent Citations Received
US Patent 11955393 Structures for bonding elements including conductive interface features
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Edits on 4 Apr, 2024
"update inverses"
Golden AI
edited on 4 Apr, 2024
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Patent Citations Received
US Patent 11948847 Bonded structures
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Edits on 21 Mar, 2024
"update inverses"
Golden AI
edited on 21 Mar, 2024
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Patent Citations Received
US Patent 11935907 Image sensor device
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Edits on 14 Mar, 2024
"update inverses"
Golden AI
edited on 14 Mar, 2024
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Patent Citations Received
US Patent 11929347 Mixed exposure for large die
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Edits on 2 Mar, 2024
"update inverses"
Golden AI
edited on 2 Mar, 2024
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Patent Citations Received
US Patent 11916054 Stacked devices and methods of fabrication
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