Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
July 17, 2007
Patent Application Number
10143015
Date Filed
May 13, 2002
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A semiconductor substrate which effectively prevents a chipping phenomenon, wherein the outer peripheral extremity of the insulation layer is located between the outer peripheral extremity of the semiconductor layer and the outer peripheral extremity of the support member, and wherein the semiconductor layer and the insulation layer produce a stepped profile.
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