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US Patent 7242081 Stacked package structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
April 24, 2006
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Date of Patent
July 10, 2007
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Patent Application Number
11409933
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Patent Citations Received
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US Patent 11700692 Stackable via package and method
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US Patent 11942581 Semiconductor device with transmissive layer and manufacturing method thereof
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US Patent 11855023 Wafer level fan out semiconductor device and manufacturing method thereof
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US Patent 12009343 Stackable package and method
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US Patent RE49987 Multiple plated via arrays of different wire heights on a same substrate
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US Patent 11990382 Fine pitch BVA using reconstituted wafer with area array accessible for testing
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Patent Inventor Names
Yonggill Lee
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
7242081
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Patent Primary Examiner
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Leonardo Andujar
0

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