Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yonggill Lee0
Date of Patent
July 10, 2007
0Patent Application Number
114099330
Date Filed
April 24, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A stacked package structure and a method for manufacturing the same are disclosed. The package structure comprises: a substrate having a first surface and a second surface in opposition to each other; at least one chip deposed on and electrically connected to the first surface of the substrate; a plurality of electrical connection devices deposed on the first surface and periphery of the substrate, wherein each electrical connection device is higher than the at least one chip in altitude; and an encapsulant covering the first surface of the substrate, the at least one chip and the electrical connection devices, wherein a top end of each electrical connection device is exposed at a surface of the encapsulant.
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