US Patent 7202552 MEMS package using flexible substrates, and method thereof

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Edits on 19 Oct, 2023

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Golden AI

edited on 19 Oct, 2023

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Patent Citations Received

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US Patent 11787690 MEMS assembly substrates including a bond layer

Edits on 6 Sep, 2023

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Patent Inventor Names

Miao Yubo0

Wang Zhe0

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Golden AI

edited on 1 Sep, 2023

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Patent abstract

A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.

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Golden AI

edited on 19 May, 2023

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Official Website

https://pdfpiw.uspto.gov/.piw?Docid=07202552

Edits on 18 May, 2023

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Golden AI