Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Josh Watson
John Szczech
Sung Bok Lee
Date of Patent
October 17, 2023
Patent Application Number
17221479
Date Filed
April 2, 2021
Patent Citations
...
Patent Primary Examiner
Patent abstract
A method of forming a micro electro mechanical system (MEMS) assembly comprises providing a substrate having an electrically conductive layer disposed thereon. The method also comprises depositing, on the substrate over the electrically conductive layer, a bonding material having an elastic modulus of less than 500 MPa so as to form a bond layer. The bond layer is completely cured, and a MEMS die is attached to the completely cured bond layer.
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