Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Miao Yubo0
Wang Zhe0
Date of Patent
April 10, 2007
Patent Application Number
11182254
Date Filed
July 15, 2005
Patent Citations Received
Patent Primary Examiner
Patent abstract
A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.
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