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US Patent 11996409 Stacking CMOS structure

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
December 9, 2020
0
Date of Patent
May 28, 2024
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Patent Application Number
17116552
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Patent Citations
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US Patent 8803316 TSV structures and methods for forming the same
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US Patent 8816444 System and methods for converting planar design to FinFET design
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US Patent 8823065 Contact structure of semiconductor device
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US Patent 8860148 Structure and method for FinFET integrated with capacitor
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US Patent 8993380 Structure and method for 3D IC package
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US Patent 9105490 Contact structure of semiconductor device
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US Patent 9236267 Cut-mask patterning process for fin-like field effect transistor (FinFET) device
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US Patent 9236300 Contact plugs in SRAM cells and the method of forming the same
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US Patent 9281254 Methods of forming integrated circuit package
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US Patent 9299649 3D packages and methods for forming the same
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•••
Patent Inventor Names
Ching-Wei Tsai
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Chia-En Huang
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Yu-Xuan Huang
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Kuan-Lun Cheng
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11996409
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Patent Primary Examiner
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David C Spalla
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CPC Code
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H01L 29/7851
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H01L 21/02603
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H01L 21/8221
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H01L 21/823431
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H01L 21/823821
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H01L 21/823871
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H01L 21/823878
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H01L 21/845
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H01L 23/481
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H01L 23/5226
0
•••

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