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US Patent 8803316 TSV structures and methods for forming the same

Overview Structured Data Issues Contributors

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Jing-Cheng Lin0

Wen-Chih Chiou0

Yung-Chi Lin0

Hsin-Yu Chen0

Ku-Feng Yang0

Tsang-Jiuh Wu0

Date of Patent

August 12, 2014

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Patent Application Number

133116920

Date Filed

December 6, 2011

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Patent Citations Received

US Patent 12137566 Peripheral circuitry under array memory device and method of fabricating thereof

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US Patent 12068285 Stacked die structure and method of fabricating the same

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US Patent 12068297 Hybrid integrated circuit package

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US Patent 12074101 Package structure and method of fabricating the same

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US Patent 12074136 Package structure and method of manufacturing the same

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US Patent 12080681 Package structure and method of fabricating the same

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US Patent 12087597 Semiconductor structure comprising various via structures

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Patent Primary Examiner

(Vikki) Hoa B Trinh

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