Log in
Enquire now
‌

US Patent 11981833 Polishing composition for semiconductor wiring

Patent 11981833 was granted and assigned to Daicel on May, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Current Assignee
Daicel
Daicel
0
Date Filed
March 18, 2020
0
Date of Patent
May 14, 2024
0
Patent Applicant
Daicel
Daicel
0
Patent Application Number
17262088
0
Patent Citations
‌
US Patent 10844334 Composition for removing resist
0
‌
US Patent 7459398 Slurry for CMP, polishing method and method of manufacturing semiconductor device
0
‌
US Patent 8273921 Polyglycerol monoether and process for producing the same
0
‌
US Patent 9346977 Abrasive, abrasive set, and method for abrading substrate
0
‌
US Patent 10196542 Abrasive, abrasive set, and method for abrading substrate
0
‌
US Patent 10466592 Agent for resist hydrophilization treatment
0
Patent Inventor Names
Yuichi Sakanishi
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11981833
0
Patent Primary Examiner
‌
James A Fiorito
0
CPC Code
‌
C09G 1/02
0

Find more entities like US Patent 11981833 Polishing composition for semiconductor wiring

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.