Log in
Enquire now
‌

US Patent 9346977 Abrasive, abrasive set, and method for abrading substrate

Patent 9346977 was granted and assigned to Hitachi on May, 2016 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors

Contents

Is a
Patent
Patent

Patent attributes

Patent Applicant
Hitachi
Hitachi
Current Assignee
Hitachi
Hitachi
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9346977
Date of Patent
May 24, 2016
Patent Application Number
14379947
Date Filed
February 14, 2013
Patent Citations Received
‌
US Patent 11981833 Polishing composition for semiconductor wiring
0
‌
US Patent 12060498 Hydrophilization treatment liquid for semiconductor wafer surface
0
Patent Primary Examiner
‌
Nadine Norton
Patent abstract

The polishing agent of the invention comprises water, an abrasive grain containing a hydroxide of a tetravalent metal element, and a specific glycerin compound.

Timeline

No Timeline data yet.

Further Resources

Title
Author
Link
Type
Date
No Further Resources data yet.

References

Find more entities like US Patent 9346977 Abrasive, abrasive set, and method for abrading substrate

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo

Company

  • Home
  • Press & Media
  • Blog
  • Careers
  • WE'RE HIRING

Products

  • Knowledge Graph
  • Query Tool
  • Data Requests
  • Knowledge Storage
  • API
  • Pricing
  • Enterprise
  • ChatGPT Plugin

Legal

  • Terms of Service
  • Enterprise Terms of Service
  • Privacy Policy

Help

  • Help center
  • API Documentation
  • Contact Us
By using this site, you agree to our Terms of Service.