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US Patent 11981833 Polishing composition for semiconductor wiring

Patent 11981833 was granted and assigned to Daicel on May, 2024 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
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Patent attributes

Patent Applicant
Daicel
Daicel
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Current Assignee
Daicel
Daicel
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119818330
Patent Inventor Names
Yuichi Sakanishi0
Date of Patent
May 14, 2024
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Patent Application Number
172620880
Date Filed
March 18, 2020
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Patent Citations
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US Patent 10844334 Composition for removing resist
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US Patent 7459398 Slurry for CMP, polishing method and method of manufacturing semiconductor device
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US Patent 8273921 Polyglycerol monoether and process for producing the same
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US Patent 9346977 Abrasive, abrasive set, and method for abrading substrate
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US Patent 10196542 Abrasive, abrasive set, and method for abrading substrate
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US Patent 10466592 Agent for resist hydrophilization treatment
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Patent Primary Examiner
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James A Fiorito
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CPC Code
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C09G 1/02
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