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US Patent 11967525 Selective tungsten deposition at low temperatures

Patent 11967525 was granted and assigned to Applied Materials on April, 2024 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Current Assignee
Applied Materials
Applied Materials
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Date Filed
August 1, 2022
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Date of Patent
April 23, 2024
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Patent Applicant
Applied Materials
Applied Materials
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Patent Application Number
17878599
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Patent Citations
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US Patent 9275865 Plasma treatment of film for impurity removal
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US Patent 9721887 Method of forming metal interconnection
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US Patent 9748105 Tungsten deposition with tungsten hexafluoride (WF6) etchback
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US Patent 9805974 Selective deposition of metallic films
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US Patent 9895715 Selective deposition of metals, metal oxides, and dielectrics
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US Patent 10014213 Selective bottom-up metal feature filling for interconnects
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US Patent 10157786 Selective formation of metallic films on metallic surfaces
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US Patent 10256144 Process integration approach of selective tungsten via fill
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US Patent 11404313 Selective tungsten deposition at low temperatures
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US Patent 11164780 Process integration approach for selective metal via fill
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•••
Patent Inventor Names
Kazuya Daito
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Yufei Hu
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Yi Xu
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Jiajie Cen
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Yu Lei
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Da He
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11967525
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Patent Primary Examiner
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Long Pham
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