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US Patent 11943904 Hybrid thermosyphon with immersion cooled evaporator

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
May 31, 2022
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Date of Patent
March 26, 2024
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Patent Application Number
17828604
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Patent Citations
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US Patent 7134289 Multi-state spray cooling system
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US Patent 7258161 Cooling system for densely packed electronic components
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US Patent 7515415 Embedded microchannel cooling package for a central processor unit
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US Patent 7556089 Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant
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US Patent 7692926 Integrated thermal systems
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US Patent 7885074 Direct jet impingement-assisted thermosyphon cooling apparatus and method
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US Patent 8014150 Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
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US Patent 8184436 Liquid-cooled electronics rack with immersion-cooled electronic subsystems
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US Patent 8188595 Two-phase cooling for light-emitting devices
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US Patent 8619425 Multi-fluid, two-phase immersion-cooling of electronic component(s)
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•••
Patent Inventor Names
Maja Harfman Todorovic
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Owen Jannis Samuel Schelenz
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Naveenan Thiagarajan
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Anindya Kanti De
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11943904
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Patent Primary Examiner
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Anthony M Haughton
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CPC Code
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H05K 7/20327
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H05K 7/20318
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H05K 7/20309
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H05K 7/20936
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