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US Patent 8184436 Liquid-cooled electronics rack with immersion-cooled electronic subsystems

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Contents

Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
81844360
Patent Inventor Names
Richard C. Chu0
Robert E. Simons0
Levi A. Campbell0
Madhusudan K. Iyengar0
Michael J. Ellsworth, Jr.0
Date of Patent
May 22, 2012
0
Patent Application Number
128257810
Date Filed
June 29, 2010
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Patent Citations Received
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US Patent 11997827 Immersion cooling system that enables increased heat flux at heat-generating components of computing devices
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US Patent 11690202 High availability heterogeneity electronic rack solution
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US Patent 11778790 Fluid cooling system
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US Patent 11906218 Redundant heat sink module
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US Patent 11943904 Hybrid thermosyphon with immersion cooled evaporator
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US Patent 11963337 Contactless device and chip thermal management plate
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US Patent 11985802 Control systems and prediction methods for it cooling performance in containment
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Patent Primary Examiner
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Robert J Hoffberg
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Patent abstract

Liquid-cooled electronics racks are provided which include: immersion-cooled electronic subsystems; a vapor-condensing heat exchanger to condense dielectric fluid vapor egressing from the immersion-cooled electronic subsystems; a dielectric fluid vapor return coupling in fluid communication the vapor outlets of the immersion-cooled electronic subsystems and the vapor-condensing heat exchanger; a reservoir for holding dielectric fluid; a gravity drain line coupled to drain dielectric fluid condensate from the vapor-condensing heat exchanger to the reservoir; an immersed, sub-cooling heat exchanger disposed within the reservoir; a dielectric fluid supply manifold coupling in fluid communication the reservoir and the dielectric fluid inlets of the immersion-cooled electronic subsystems; and a pump for supplying under pressure dielectric fluid from the reservoir to the dielectric fluid supply manifold for maintaining dielectric fluid in a liquid state within the immersion-cooled electronic subsystems.

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