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US Patent 11943904 Hybrid thermosyphon with immersion cooled evaporator

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Is a
Patent
Patent
0

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
119439040
Patent Inventor Names
Maja Harfman Todorovic0
Owen Jannis Samuel Schelenz0
Naveenan Thiagarajan0
Anindya Kanti De0
Date of Patent
March 26, 2024
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Patent Application Number
178286040
Date Filed
May 31, 2022
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Patent Citations
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US Patent 7134289 Multi-state spray cooling system
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US Patent 7258161 Cooling system for densely packed electronic components
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US Patent 7515415 Embedded microchannel cooling package for a central processor unit
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US Patent 7556089 Liquid cooled thermosiphon with condenser coil running in and out of liquid refrigerant
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US Patent 7692926 Integrated thermal systems
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US Patent 7885074 Direct jet impingement-assisted thermosyphon cooling apparatus and method
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US Patent 8014150 Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling
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US Patent 8184436 Liquid-cooled electronics rack with immersion-cooled electronic subsystems
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...
Patent Primary Examiner
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Anthony M Haughton
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CPC Code
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H05K 7/20327
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H05K 7/20318
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H05K 7/20309
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H05K 7/20936
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Patent abstract

A cooling system is provided. The cooling system includes a condenser configured to condense a coolant from a vapor state to a liquid state and an evaporator configured to evaporate the coolant from the liquid state to the vapor state. The evaporator defines a reservoir configured to contain a volume of the coolant in the liquid state. The cooling system further includes a vapor channel fluidly coupled to the condenser and the evaporator and configured to convey the coolant in the vapor state from the evaporator to the condenser, a liquid channel coupled to the condenser and the evaporator and configured to convey the coolant in the liquid state from the condenser to the evaporator, and a heat generating component disposed in the reservoir and immersed in the volume of the coolant in the liquid state. The heat generating component is configured to dissipate heat into the coolant.

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