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US Patent 11916534 Microelectromechanical resonator

Patent 11916534 was granted and assigned to SiTime on February, 2024 by the United States Patent and Trademark Office.

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Is a
Patent
Patent
0

Patent attributes

Patent Applicant
SiTime
SiTime
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Current Assignee
SiTime
SiTime
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
119165340
Patent Inventor Names
Paul M. Hagelin0
Charles I. Grosjean0
Joseph C. Doll0
Nicholas Miller0
Ginel C. Hill0
Date of Patent
February 27, 2024
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Patent Application Number
178474380
Date Filed
June 23, 2022
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Patent Citations
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US Patent 7439658 Piezoelectric vibrator, oscillator, electronic part, electronic apparatus, method of fabricating piezoelectric vibrator and method of fabricating electronic part
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US Patent 7202761 Temperature compensation for silicon MEMS resonator
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US Patent 7369003 Oscillator system having a plurality of microelectromechanical resonators and method of designing, controlling or operating the same
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US Patent 7369004 Microelectromechanical oscillator and method of operating same
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US Patent 7443258 Oscillator system having a plurality of microelectromechanical resonators and method of designing, controlling or operating same
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US Patent 7446619 Temperature measurement system having a plurality of microelectromechanical resonators and method of operating same
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US Patent 7446620 Microelectromechanical oscillator having temperature measurement system, and method of operating same
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US Patent 7545228 Dynamic temperature compensation for a digitally controlled oscillator using dual MEMS resonators
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Patent Primary Examiner
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Jeffrey M Shin
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CPC Code
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H03H 9/2463
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H03H 3/0077
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H03H 2003/027
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H03H 2009/02181
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H03H 2009/02307
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H03H 2009/155
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H03H 9/17
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H03H 9/1057
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Patent abstract

A moveable micromachined member of a microelectromechanical system (MEMS) device includes an insulating layer disposed between first and second electrically conductive layers. First and second mechanical structures secure the moveable micromachined member to a substrate of the MEMS device and include respective first and second electrical interconnect layers coupled in series, with the first electrically conductive layer of the moveable micromachined member and each other, between first and second electrical terminals to enable conduction of a first joule-heating current from the first electrical terminal to the second electrical terminal through the first electrically conductive layer of the moveable micromachined member.

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