US Patent 11855001 Leadless leadframe and semiconductor device package therefrom

A semiconductor device package includes a leadless leadframe, and a plurality of terminal pads extending to a periphery of the leadframe. At least two of the plurality of terminal pads are interior extending terminal pads that include an interior portion having a shape including at least one curved portion and an exterior portion that extends to the periphery of the leadframe. An integrated circuit (IC) die having at least a semiconductor surface includes circuitry configured for at least one function having nodes connected to bond pads on the leadframe. There is a bonding arrangement between the plurality of terminal pads and the bond pads. A mold compound is for encapsulation of the semiconductor device package.