Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Louis Elliott Pflughaupt0
Young-Gon Kim0
Nikhil Vishwanath Kelkar0
Date of Patent
May 11, 2010
0Patent Application Number
114532160
Date Filed
June 15, 2006
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a lead structure upon which a semiconductor die is mounted with at least some portion of at least some of the leads extending to, at, or across an axis or axis of the package to militate against thermally induced growth of the package and the reduce or minimize strain within the package and reliability issuse associated therewith.
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