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US Patent 10304759 Electronic device and method of making same

Patent 10304759 was granted and assigned to Nexperia on May, 2019 by the United States Patent and Trademark Office.

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Patent
Patent

Patent attributes

Patent Applicant
Nexperia
Nexperia
Current Assignee
Nexperia
Nexperia
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10304759
Date of Patent
May 28, 2019
Patent Application Number
15229133
Date Filed
August 5, 2016
Patent Citations Received
‌
US Patent 11855001 Leadless leadframe and semiconductor device package therefrom
0
Patent Primary Examiner
‌
Andy Huynh
Patent abstract

An electronic device has a first surface, a second surface opposite to the first surface, and sidewalls located between and adjoining the first and second surfaces. The electronic device includes contact pads on the first surface. The contact pads extend from the first surface to adjoining sidewalls, and abut the sidewalls.

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