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US Patent 11839054 Stack-PCB design and midplane architecture

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
0
Date Filed
September 22, 2021
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Date of Patent
December 5, 2023
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Patent Application Number
17482229
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Patent Citations
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US Patent 8274792 3-dimensional multi-layered modular computer architecture
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US Patent 9578780 Heat dissipating device
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US Patent 9547344 Support frame with integrated thermal management features
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US Patent 9639127 Heat dissipating apparatus and electronic device having the same
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US Patent 7068515 Multi-chip module with stacked redundant power
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US Patent 7286365 Electronic substrate for a three-dimensional electronic module
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Patent Inventor Names
Patrick Codd
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Brian Toleno
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Michael Nikkhoo
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11839054
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Patent Primary Examiner
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Anthony M Haughton
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CPC Code
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H05K 7/06
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H05K 7/023
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H05K 7/20336
0

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