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US Patent 8274792 3-dimensional multi-layered modular computer architecture

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Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8274792
Patent Inventor Names
Aviv Soffer0
Date of Patent
September 25, 2012
Patent Application Number
12066003
Date Filed
September 6, 2006
Patent Citations Received
‌
US Patent 11839054 Stack-PCB design and midplane architecture
0
‌
US Patent 11751350 Systems and methods for providing a robust computer processing unit
Patent Primary Examiner
‌
Gregory Thompson
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