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US Patent 8274792 3-dimensional multi-layered modular computer architecture

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
Date Filed
September 6, 2006
Date of Patent
September 25, 2012
Patent Application Number
12066003
Patent Citations Received
‌
US Patent 11839054 Stack-PCB design and midplane architecture
0
‌
US Patent 11751350 Systems and methods for providing a robust computer processing unit
Patent Inventor Names
Aviv Soffer
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8274792
Patent Primary Examiner
‌
Gregory Thompson

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