US Patent 9547344 Support frame with integrated thermal management features

This invention describes a novel solution to providing heat redistribution and cooling to electronic devices. According to various embodiments, heat produced during the operation of the processing components in the computing device is absorbed by heat management features integrated within a supporting mid-frame. Liquid (e.g., coolants) contained in the portion of the heat management features most proximate to the processing components evaporates due to the absorbed heat, and is conducted (via convection) towards the other end of the heat management features, where the temperature is cooler. Once sufficiently cooled, the evaporated coolant condenses back into liquid form and flows back towards the other end of the heat management features.