US Patent 11839054 Stack-PCB design and midplane architecture
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US Patent 11839054 Stack-PCB design and midplane architecture
Article
Patent abstract
A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.
Infobox
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Patent Jurisdiction
Patent Number
Patent Inventor Names
Brian Toleno0
Michael Nikkhoo0
Patrick Codd0
Date of Patent
December 5, 2023
0Patent Application Number
174822290
Date Filed
September 22, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
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