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US Patent 11839054 Stack-PCB design and midplane architecture

Overview Structured Data Issues Contributors

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Patrick Codd1

Brian Toleno1

Michael Nikkhoo1

Date of Patent

December 5, 2023

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Patent Application Number

174822291

Date Filed

September 22, 2021

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Patent Citations

US Patent 8274792 3-dimensional multi-layered modular computer architecture

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US Patent 9578780 Heat dissipating device

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US Patent 9547344 Support frame with integrated thermal management features

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US Patent 9639127 Heat dissipating apparatus and electronic device having the same

1

US Patent 7068515 Multi-chip module with stacked redundant power

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US Patent 7286365 Electronic substrate for a three-dimensional electronic module

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Patent Primary Examiner

Anthony M Haughton

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CPC Code

1

1

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Patent abstract

A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.

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