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US Patent 11804431 Laser-formed interconnects for redundant devices

Overview Structured Data Issues Contributors

Is a

Patent

Date Filed

February 14, 2022

Date of Patent

October 31, 2023

Patent Application Number

17670810

Patent Citations

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US Patent 8835940 Micro device stabilization post

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US Patent 8794501 Method of transferring a light emitting diode

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US Patent 8865489 Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays

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US Patent 8877648 Methods of forming printable integrated circuit devices by selective etching to suspend the devices from a handling substrate and devices formed thereby

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US Patent 8889485 Methods for surface attachment of flipped active componenets

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US Patent 8934259 Substrates with transferable chiplets

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US Patent 8941215 Micro device stabilization post

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US Patent 8987765 Reflective bank structure and method for integrating a light emitting device

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US Patent 9049797 Electrically bonded arrays of transfer printed active components

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US Patent 9087764 Adhesive wafer bonding with controlled thickness variation

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Patent Inventor Names

Ronald S. Cok

Christopher Andrew Bower

Matthew Alexander Meitl

Erik Paul Vick

Erich Radauscher

Christopher Michael Verreen

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

11804431

Patent Primary Examiner

CPC Code

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