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US Patent 9049797 Electrically bonded arrays of transfer printed active components

Patent 9049797 was granted and assigned to Semprius on June, 2015 by the United States Patent and Trademark Office.

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Contents

Is a
Patent
Patent

Patent attributes

Current Assignee
Semprius
Semprius
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
9049797
Patent Inventor Names
Matthew Meitl0
Philip Garrou0
Christopher Bower0
Etienne Menard0
Date of Patent
June 2, 2015
Patent Application Number
13638040
Date Filed
March 22, 2011
Patent Citations Received
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US Patent 12074583 Printing components to adhesive substrate posts
0
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US Patent 11884537 Enclosed cavity structures
0
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US Patent 11890890 Rigid micro-modules with iLED and light conductor
0
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US Patent 11950375 Printing components to substrate posts
0
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US Patent 11952266 Micro-device structures with etch holes
0
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US Patent 11981559 Enclosed cavity structures
0
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US Patent 12006205 Micro-device structures with etch holes
0
0
...
Patent Primary Examiner
‌
Hoa C Nguyen
Patent abstract

An active component array includes a target substrate having one or more contacts formed on a side of the target substrate, and one or more printable active components distributed over the target substrate. Each active component includes an active layer having a top side and an opposing bottom side and one or more active element(s) formed on or in the top side of the active layer. The active element(s) are electrically connected to the contact(s), and the bottom side is adhered to the target substrate. Related fabrication methods are also discussed.

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