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US Patent 8889485 Methods for surface attachment of flipped active componenets

Patent 8889485 was granted and assigned to Semprius on November, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Semprius

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8889485

Date of Patent

November 18, 2014

Patent Application Number

13491196

Date Filed

June 7, 2012

Patent Citations Received

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US Patent 12112678 Hybrid pulse-width-modulation pixels

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US Patent 12080690 Micro assembled LED displays and lighting elements

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US Patent 12078689 Stray field rejection in magnetic sensors

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US Patent 12094851 Particle capture using transfer stamp

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US Patent 11670602 Secure integrated-circuit systems

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US Patent 11670533 Multi-level micro-device tethers

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US Patent 11670603 Micro-component anti-stiction structures

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US Patent 11705439 LED color displays with multi-LED sub-pixels

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Patent Primary Examiner

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Karen Kusumakar

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