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US Patent 11791236 Semiconductor module

Overview Structured Data Issues Contributors Activity

Is a

Date Filed

June 29, 2021

Date of Patent

October 17, 2023

Patent Application Number

17361644

Patent Citations

US Patent 10658266 Thermoelectric cooling packages and thermal management methods thereof

US Patent 9746889 Package-on-package (PoP) device comprising bi-directional thermal electric cooler

US Patent 10504816 Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages

US Patent 7603205 Apparatus and method for thermal stabilization of PCB-mounted electronic components within an enclosed housing

US Patent 8546924 Package structures for integrating thermoelectric components with stacking chips

US Patent 8649179 Circuit assemblies including thermoelectric modules

US Patent 8866309 Chip package structure

US Patent 9491865 Circuit board and method for manufacturing the same

US Patent 9559283 Integrated circuit cooling using embedded peltier micro-vias in substrate

Patent Inventor Names

Jaebeom Byun

Taehoi Hwang

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Patent Primary Examiner

Peniel M Gumedzoe

CPC Code

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