US Patent 11791236 Semiconductor module

A semiconductor module may include a first PCB, at least one first semiconductor chip, a heat sink and at least one first TEC. The at least one semiconductor chip is on the first PCB. The heat sink may be configured to surround the first PCB and the at least one semiconductor control chip. The first TEC may be on the first PCB to cool heat from the first PCB. Thus, performances of the semiconductor module may not be deteriorated by the heat.