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US Patent 8866309 Chip package structure

Patent 8866309 was granted and assigned to Industrial Technology Research Institute on October, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Patent Applicant

Industrial Technology Research Institute

Current Assignee

Industrial Technology Research Institute

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8866309

Patent Inventor Names

Yu-Wei Huang0

Jing-Yao Chang0

Shin-Yi Huang0

Tao-Chih Chang0

Yu-Min Lin0

Date of Patent

October 21, 2014

Patent Application Number

13727599

Date Filed

December 27, 2012

Patent Citations Received

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US Patent 11832382 Printed circuit board and a storage system including the same

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US Patent 11756802 Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit device

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US Patent 11791236 Semiconductor module

Patent Primary Examiner

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Theresa T Doan

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