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US Patent 11656273 High current device testing apparatus and systems

Overview Structured Data Issues Contributors

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Date of Patent

May 23, 2023

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Patent Application Number

175202021

Date Filed

November 5, 2021

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Patent Citations

US Patent 7355428 Active thermal control system with miniature liquid-cooled temperature control device for electronic device testing

1

US Patent 7436059 Thermoelectric cooling device arrays

1

US Patent 7519880 Burn-in using system-level test hardware

1

US Patent 7659738 Test sockets having peltier elements, test equipment including the same and methods of testing semiconductor packages using the same

1

US Patent 7726145 Temperature control unit for electronic component and handler apparatus

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US Patent 7755899 Miniaturized high conductivity thermal/electrical switch

1

US Patent 7781883 Electronic package with a thermal interposer and method of manufacturing the same

1

US Patent 8552540 Wafer level package with thermal pad for higher power dissipation

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...

Patent Primary Examiner

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CPC Code

1

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Embodiments of the present invention provide systems and methods for performing automated device testing at high power using ATI-based thermal management that substantially mitigates or prevents the pads and pins thereof from being burned or damaged. In this way, the lifespan of the testing equipment is improved and the expected downtime of testing equipment is substantially reduced, while also reducing cost of operation.

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