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US Patent 7519880 Burn-in using system-level test hardware

Patent 7519880 was granted and assigned to Advanced Micro Devices on April, 2009 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
Advanced Micro Devices
Advanced Micro Devices
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
75198800
Patent Inventor Names
Glenn Eubank0
Chandrakant Pandya0
Jeff Brinkley0
John Heon Yi0
Michael Gregory Tarin0
Satwant Singh0
Steven Russell Klassen0
Trent William Johnson0
Date of Patent
April 14, 2009
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Patent Application Number
111748230
Date Filed
July 5, 2005
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Patent Citations Received
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US Patent 11774492 Test system including active thermal interposer device
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US Patent 11835549 Thermal array with gimbal features and enhanced thermal performance
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US Patent 11841392 Integrated test cell using active thermal interposer (ATI) with parallel socket actuation
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US Patent 11656273 High current device testing apparatus and systems
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US Patent 11674999 Wafer scale active thermal interposer for device testing
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US Patent 11754620 DUT placement and handling for active thermal interposer device
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US Patent 11940487 Thermal solution for massively parallel testing
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US Patent 11852678 Multi-input multi-zone thermal control for device testing
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...
Patent Primary Examiner
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Cynthia Britt
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Patent abstract

A burn-in test system. A burn-in test system includes a device under test (DUT), a temperature controller coupled to the DUT, and a test controller. During testing, the test controller: (a) sets a parameter of the DUT to a first value and applies a test stimulus to the DUT, and (b) sets the parameter of the DUT to a second value and applies the test stimulus to the DUT. A change in the value of the parameter results in a change in the amount of heat dissipated by the DUT. The temperature controller maintains the DUT at a pre-determined temperature during testing with the parameter set to both the first and the second values. The DUT may be further coupled to a module that comprises circuitry employed in a product-level application environment. The module is configured by the test controller to simulate a product-level application.

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