Log in
Sign up
Golden has been acquired by ComplyAdvantage.Read about it here ⟶
‌

US Patent 11621247 Semiconductor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
March 17, 2021
0
Date of Patent
April 4, 2023
0
Patent Application Number
17203909
0
Patent Citations
‌
US Patent 11239225 Three-dimensional integrated circuit structures and methods of manufacturing the same
‌
US Patent 10818624 Semiconductor structure and method for manufacturing the same
0
‌
US Patent 10840190 Semiconductor structure and manufacturing method thereof
0
‌
US Patent 10157867 Interconnect structure and method
0
‌
US Patent 10312201 Seal ring for hybrid-bond
0
‌
US Patent 10461069 Hybrid bonding with through substrate via (TSV)
0
‌
US Patent 10777534 Three-dimensional stacking structure
0
‌
US Patent 10796990 Semiconductor structure, package structure, and manufacturing method thereof
0
‌
US Patent 10797031 Semiconductor package
0
Patent Inventor Names
Youngmin Lee
0
Sangcheon Park
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
0
Patent Number
11621247
0
Patent Primary Examiner
‌
Victor A Mandala
0
CPC Code
‌
H01L 23/5386
0
‌
H01L 23/481
0
‌
H01L 23/49838
0
‌
H01L 23/12
0
‌
H01L 23/5385
0
‌
H01L 2224/06177
0
‌
H01L 24/06
0
‌
H01L 24/03
0
‌
H01L 21/76898
0
‌
H01L 25/0657
0
•••

Find more entities like US Patent 11621247 Semiconductor package

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
Open Query Tool
Access by API
Golden Query Tool
Golden logo
By using this site, you agree to our Terms of Service.