Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 29, 2019
Patent Application Number
15997156
Date Filed
June 4, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device structure is provided. The semiconductor device structure includes a bonding structure formed between a first substrate and a second substrate. The bonding structure includes a first polymer bonded to a second polymer, and a first conductive material bonded to a second conductive material. The semiconductor device includes a first TSV formed in the first substrate and an interconnect structure formed over the first TSV. The first TSV is between the interconnect structure and the bonding structure.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
