Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Ming-Fa Chen0
Sen-Bor Jan0
Chih-Chia Hu0
Chun-Chiang Kuo0
Hsien-Wei Chen0
Date of Patent
June 4, 2019
0Patent Application Number
160036540
Date Filed
June 8, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A structure includes a first die and a second die. The first die includes a first oxide bonding layer having a first plurality of bond pads disposed therein and a first seal ring disposed in the first oxide bonding layer. The first oxide bonding layer extends over the first seal ring. The second die includes a second oxide bonding layer having a second plurality of bond pads disposed therein. The first plurality of bond pads is bonded to the second plurality of bond pads. The first oxide bonding layer is bonded to the second oxide bonding layer. An area interposed between the first seal ring and the second oxide bonding layer is free of bond pads.
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