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US Patent 11610844 High performance module for SiP

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
0
Date Filed
October 11, 2018
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Date of Patent
March 21, 2023
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Patent Application Number
16755376
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Patent Citations
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US Patent 10468384 Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same
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US Patent 10636765 System-in-package with double-sided molding
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US Patent 10347585 Fan-out semiconductor package
Patent Inventor Names
Gene Alan Frantz
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Peter Robert Linder
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Masood Murtuza
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Erik James Welsh
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
11610844
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Patent Primary Examiner
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Nicholas J Tobergte
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CPC Code
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H01L 25/0652
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H01L 25/0655
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H01L 25/0657
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H01L 2924/15311
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H01L 23/5386
0
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H01L 23/498
0
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H01L 21/56
0
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H01L 23/5383
0
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G11C 5/04
0
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H01L 24/16
0

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