US Patent 11610844 High performance module for SiP
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Patent Inventor Names
Erik James Welsh0
Gene Alan Frantz0
Masood Murtuza0
Peter Robert Linder0
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US Patent 11610844 High performance module for SiP
Article
High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.
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Patent Jurisdiction
Patent Number
116108440
Date of Patent
March 21, 2023
0Patent Application Number
167553760
Date Filed
October 11, 2018
0Patent Citations
Patent Primary Examiner
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