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US Patent 11610844 High performance module for SiP

Overview Structured Data Issues Contributors Activity

Is a

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Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Gene Alan Frantz0

Peter Robert Linder0

Masood Murtuza0

Erik James Welsh0

Date of Patent

March 21, 2023

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Patent Application Number

167553760

Date Filed

October 11, 2018

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Patent Citations

US Patent 10468384 Semiconductor device and method of forming embedded die substrate, and system-in-package modules with the same

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US Patent 10636765 System-in-package with double-sided molding

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US Patent 10347585 Fan-out semiconductor package

Patent Primary Examiner

Nicholas J Tobergte

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CPC Code

0

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H01L 2924/15311

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High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

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