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US Patent 11600542 Cavity packages

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edited on 10 Apr, 2024
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Patent Citations Received
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US Patent 11955393 Structures for bonding elements including conductive interface features
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Patent Citations Received
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US Patent 11948847 Bonded structures
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Infobox
Is a
Patent
Patent
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
116005420
Date of Patent
March 7, 2023
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Patent Application Number
171463040
Date Filed
January 11, 2021
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Patent Citations
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US Patent 11205600 Integrated circuits protected by substrates with cavities, and methods of manufacture
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US Patent 10002844 Bonded structures
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10075657 Edgeless large area camera system
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US Patent 10204893 Stacked dies and methods for forming bonded structures
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US Patent 10269756 Die processing
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein
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US Patent 10418277 Air gap spacer formation for nano-scale semiconductor devices
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US Patent 10446456 Integrated circuits protected by substrates with cavities, and methods of manufacture
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US Patent 10446487 Interface structures and methods for forming same
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US Patent 10446532 Systems and methods for efficient transfer of semiconductor elements
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US Patent 10508030 Seal for microelectronic assembly
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US Patent 10522499 Bonded structures
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US Patent 10615133 Die package with superposer substrate for passive components
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US Patent 10658312 Embedded millimeter-wave phased array module
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US Patent 10707087 Processing stacked substrates
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US Patent 10727219 Techniques for processing devices
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US Patent 10784191 Interface structures and methods for forming same
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US Patent 10790262 Low temperature bonded structures
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US Patent 10840205 Chemical mechanical polishing for hybrid bonding
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US Patent 10879212 Processed stacked dies
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US Patent 10923408 Cavity packages
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US Patent 10964664 DBI to Si bonding for simplified handle wafer
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US Patent 10998292 Offset pads over TSV
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US Patent 11004757 Bonded structures
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US Patent 11031285 Diffusion barrier collar for interconnects
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US Patent 11056348 Bonding surfaces for microelectronics
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US Patent 11256004 Direct-bonded lamination for improved image clarity in optical devices
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US Patent 11257727 Seal for microelectronic assembly
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US Patent 11276676 Stacked devices and methods of fabrication
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Patent Primary Examiner
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Michelle Mandala
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Edits on 2 Apr, 2023
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