Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
March 7, 2023
Patent Application Number
17146304
Date Filed
January 11, 2021
Patent Citations
...
Patent Citations Received
Patent Primary Examiner
An integrated device package is disclosed. The integrated device package can include an integrated device die, an element, a cavity, and an electrical interconnect. The element can have an antenna structure. The element can be attached to a surface of the integrated device. The cavity can be disposed between the integrated device die and the antenna structure. The electrical interconnect can connect the integrated device die and the antenna structure.
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