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US Patent 10784191 Interface structures and methods for forming same

Overview Structured Data Issues Contributors

Is a

Patent attributes

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

September 22, 2020

Patent Application Number

15940273

Date Filed

March 29, 2018

Patent Citations

US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die

US Patent 10075657 Edgeless large area camera system

US Patent 10269756 Die processing

US Patent 10204893 Stacked dies and methods for forming bonded structures

US Patent 10276909 Structure comprising at least a first element bonded to a carrier having a closed metallic channel waveguide formed therein

US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer

US Patent 10002844 Bonded structures

Patent Citations Received

US Patent 12132020 Low temperature bonded structures

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US Patent 12113054 Non-volatile dynamic random access memory

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US Patent 12113056 Stacked dies and methods for forming bonded structures

0

US Patent 11515279 Low temperature bonded structures

US Patent 11244920 Method and structures for low temperature device bonding

US Patent 11600542 Cavity packages

US Patent 11621246 Diffused bitline replacement in stacked wafer memory

US Patent 11257727 Seal for microelectronic assembly

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