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US Patent 11056348 Bonding surfaces for microelectronics

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 1, 2019
Date of Patent
July 6, 2021
Patent Application Number
16371402
Patent Citations
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US Patent 10269756 Die processing
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10075657 Edgeless large area camera system
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
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US Patent 11476213 Bonded structures without intervening adhesive
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US Patent 11515202 3D IC method and device
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US Patent 11515279 Low temperature bonded structures
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US Patent 11538781 Integrated device packages including bonded structures
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US Patent 11552041 Chemical mechanical polishing for hybrid bonding
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US Patent 11600542 Cavity packages
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US Patent 12125784 Interconnect structures
0
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US Patent 12132020 Low temperature bonded structures
0
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US Patent 11462419 Microelectronic assemblies
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11056348
Patent Primary Examiner
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Mohammad M Hoque

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