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US Patent 11011503 Direct-bonded optoelectronic interconnect for high-density integrated photonics

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 13, 2018
Date of Patent
May 18, 2021
Patent Application Number
16219693
Patent Citations
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10269756 Die processing
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US Patent 10075657 Edgeless large area camera system
Patent Citations Received
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US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
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US Patent 12125784 Interconnect structures
0
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US Patent 12132020 Low temperature bonded structures
0
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US Patent 11459123 Method for assembling at least two parts by transparent welding, method for assembling a primary structure of an aircraft pylon by transparent welding, primary structure of an aircraft pylon thus obtained and aircraft comprising said primary structure
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US Patent 11621246 Diffused bitline replacement in stacked wafer memory
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US Patent 11626363 Bonded structures with integrated passive component
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US Patent 11631586 Heterogeneous annealing method
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US Patent 11631647 Integrated device packages with integrated device die and dummy element
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US Patent 11652083 Processed stacked dies
0
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US Patent 11658173 Stacked dies and methods for forming bonded structures
0
•••
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11011503
Patent Primary Examiner
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S. V. Clark

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