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US Patent 10872765 Selective layer formation using deposition and removing

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 30, 2019
Date of Patent
December 22, 2020
Patent Application Number
16399328
Patent Citations
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US Patent 10014212 Selective deposition of metallic films
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US Patent 10041166 Reaction chamber passivation and selective deposition of metallic films
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US Patent 10049924 Selective formation of metallic films on metallic surfaces
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US Patent 10115603 Removal of surface passivation
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US Patent 10186420 Formation of silicon-containing thin films
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US Patent 10157786 Selective formation of metallic films on metallic surfaces
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US Patent 10428421 Selective deposition on metal or metallic surfaces relative to dielectric surfaces
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US Patent 10546741 Selective growth method
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US Patent 10480064 Reaction chamber passivation and selective deposition of metallic films
Patent Citations Received
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US Patent 11446699 Vapor phase deposition of organic films
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US Patent 11501966 Selective layer formation using deposition and removing
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US Patent 11387107 Deposition of organic films
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US Patent 11430656 Deposition of oxide thin films
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US Patent 11501965 Plasma enhanced deposition processes for controlled formation of metal oxide thin films
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US Patent 11804373 Selective layer formation using deposition and removing
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10872765
Patent Primary Examiner
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Ratisha Mehta

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