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US Patent 10515913 Multi-metal contact structure

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
March 13, 2018
Date of Patent
December 24, 2019
Patent Application Number
15919894
Patent Citations
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US Patent 10026605 Method of reducing residual contamination in singulated semiconductor die
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US Patent 10276619 Semiconductor device structure with a conductive feature passing through a passivation layer
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US Patent 10269756 Die processing
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US Patent 10075657 Edgeless large area camera system
Patent Citations Received
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US Patent 12132020 Low temperature bonded structures
0
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US Patent 12027487 Structures for low temperature bonding using nanoparticles
0
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US Patent 11515279 Low temperature bonded structures
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US Patent 11710718 Structures and methods for low temperature bonding using nanoparticles
0
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US Patent 11894326 Multi-metal contact structure
0
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US Patent 11908739 Flat metal features for microelectronics applications
0
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US Patent 11973045 Semiconductor structure and method for forming same
0
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US Patent 11973056 Methods for low temperature bonding using nanoparticles
0
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US Patent 11990436 Electronic circuit for a hybrid molecular bonding
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10515913
Patent Primary Examiner
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Didarul A Mazumder

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