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US Patent 10435773 Rapidly solidified high-temperature aluminum iron silicon alloys

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Is a
Patent
Patent

Patent attributes

Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10435773
Date of Patent
October 8, 2019
Patent Application Number
16375099
Date Filed
April 4, 2019
Patent Citations Received
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US Patent 12115583 Systems and methods for adhesive-based part retention features in additively manufactured structures
3
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US Patent 11504912 Selective end effector modular attachment device
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US Patent 12103008 Methods and apparatuses for ball milling to produce powder for additive manufacturing
5
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US Patent 12111638 Adaptive production system
6
‌
US Patent 11479015 Custom formed panels for transport structures and methods for assembling same
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US Patent 11529741 System and method for positioning one or more robotic apparatuses
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US Patent 10605285 Systems and methods for joining node and tube structures
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US Patent 11534828 Assembling structures comprising 3D printed components and standardized components utilizing adhesive circuits
...
Patent Primary Examiner
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Cam N. Nguyen
Patent abstract

High-strength, lightweight alloy components, such as automotive components, capable of high temperature performance comprising aluminum, silicon, and iron and/or nickel are provided, along with methods of making such high-strength, lightweight alloy components. A high-energy stream, such as a laser or electron beam, may be selectively directed towards a precursor material to melt a portion of the precursor material in a localized region. The molten precursor material is cooled at a rate of greater than or equal to about 1.0×105 K/second to form a solid high-strength, lightweight alloy component comprising a stable ternary cubic phase having high heat resistance and high strength. The stable ternary phase may be AlxFeySiz, where x ranges from about 4 to about 5 or about 7.2 to about 7.6, y is about 1.5 to about 2.2, and z is about 1. The stable ternary phase may also be Al6Ni3Si.

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